Kick-off PIXEurope: Coordinated by ICFO, the PIXEurope Pilot line officially kicks-off in Barcelona and unites leading European research institutions to establish the world’s first Open Access photonic integrated circuit ecosystem. PICs, which transmit data using light instead of electrical signals, enable communication with higher bandwidth and lower energy consumption. These chips will represent the backbone of future 6G networks, data centers, artificial intelligence (AI) or biomedical devices. By integrating multiple functions into a single chip, PICs reduce manufacturing costs and enable novel application areas, positioning Europe as a global leader in next-generation photonic technologies.
Austrian Minister for Innovation Peter Hanke comments: “Research and technology are the driving forces behind Austria’s productivity and competitiveness. It is therefore important to me to make targeted investments in innovation, even in difficult budgetary times. The PIXEurope pilot line is another strategic milestone for Europe as a technology location. Through Silicon Austria Labs, Austria is once again making a strong contribution to accelerating technological progress, strengthening industrial performance and supporting the EU’s goals in the area of digital and green transformation. In addition, the initiative will contribute to the creation of high-tech jobs and strengthen Europe’s technological sovereignty.”
SAL’s Contribution: Advancing High-Performance Materials and Integration Technologies
SAL will leverage its leading expertise in integrated photonic and thin-film integration to contribute to developing scalable, high-performance fabrication processes and ensure smooth technology transfer to industrial partners. A key focus for SAL will be the integration of high-performance electro-optic materials such as Thin-Film Lithium Niobate (TFLN) and Aluminum Nitride (AlN). These materials will be integrated onto silicon and silicon nitride PIC platforms, enabling ultra-fast modulation, low-power photonic signal processing, and broadband operation. Such capabilities are essential to realizing next-generation green and efficient photonic technologies.
Mohssen Moridi, Senior Director at SAL: “We are proud to be a key player in this pilot line and collaborate with other major players in Europe. Our capabilities in integrating TFLN and AlN onto 200mm wafer platforms — combined with advanced microfabrication — will unlock new application fields and strengthen Europe’s position in photonic chip innovation.”
Empowering Europe’s Technological Future
PIXEurope represents a significant leap forward in Europe’s goal to lead in photonic chip development. By enabling faster prototyping, scalable production, and open access to the next generation of photonic technologies, the initiative will empower startups, SMEs, and established industry players alike to thrive in the fast-evolving digital economy.
