TDK Corporation has launched the FS3303, the first product in its expanded micro POL family of ultra-compact, non-isolated DC-DC power modules designed for optical modules, AI edge systems, and other compact electronic applications.
Measuring only 2.5 mm × 2.5 mm with a slim 1.2 mm profile, the FS3303 delivers up to 3 A output current while maintaining high efficiency of around 95%. The module supports operation at ambient temperatures up to +90 °C, or up to +125 °C with derating, and is already in full production with sampling available through major distributors.
The new micro POL portfolio will eventually support output currents ranging from 3 A to 80 A and voltage rails between 0.3 V and 3.3 V. These solutions are aimed at next-generation AI accelerators and high-speed optical networking platforms, helping manufacturers improve performance without increasing board space requirements.
The FS3303 is optimized for low-voltage applications, supporting input voltages from 2.7 V to 6 V and output voltages from 0.4 V to 3.3 V. This makes it suitable for powering ASICs, SoCs, DSPs, and advanced AI chipsets that demand precise voltage regulation and fast transient response.
The module uses TDK’s proprietary 3D chip-embedded packaging technology, integrating the controller, driver, MOSFETs, and power inductor into a single compact package. This design reduces the need for external components while saving valuable board space and height, making it ideal for compact optical transceivers and edge AI hardware.
