Asahi Kasei has completed the construction of a new slitting facility for its SUNFORT dry film photoresist (DFR) products at its Tainan, Taiwan manufacturing site. The facility, inaugurated on July 3, is expected to begin commercial operations this month.
The company has been processing SUNFORT DFR through slitting operations in Tainan since 1997. With the rapid expansion of advanced semiconductor packaging, fueled by the growth of AI and rising data processing demands, the need for high-quality and dependable DFR materials has increased. Taiwan’s position as a major hub for semiconductor packaging companies makes it a key location for strengthening supply capabilities. The new facility will help Asahi Kasei provide faster and more reliable product delivery while staying closer to its customers.
Slitting is the process by which master rolls of film are cut into narrower widths in accordance with individual customer requirements. It is a critical process that directly impacts both product quality and supply reliability.
To respond to growing market demand for DFR, Asahi Kasei’s new slitting facility is equipped with state-of-the-art machines and some of the most rigorous cleanroom standards for improved productivity and dependable supply. The facility represents an investment of approximately ¥2 billion (approximately $12 million or €11 million) and will expand capacity by 40% with the potential to double current output.
SUNFORT DFR delivers ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates for packaging. This approach improves performance and precision in semiconductor manufacturing back-end processes.
Asahi Kasei’s investment in SUNFORT DFR aligns with the company’s positioning of its Electronics Business as a strategic growth driver. In May 2025, Asahi Kasei also launched SUNFORT TA, its newest DFR series tailored for advanced semiconductor packaging used in AI servers.
