EnSilica, a leading chip maker of mixed-signal ASICs, has recently announced it has become an Open Innovation Platform (“OIP”) partner for TSMC, the world’s leading semiconductor manufacturer. EnSilica’s value in enabling the next-generation of system-on-chips (SoCs), ranging from mixed signal devices for industrial and automotive applications to communications and edge artificial intelligence (AI) chips using TSMC’s most advanced process technologies. The company has also now surpassed the key milestone of shipping five million ASIC units for use in a premium manufacturer’s SUV chassis control unit fabricated using TSMC’s automotive qualified technology.
The ASIC, specifically designed for electronic suspension control systems in the prestige SUV, is fully qualified to the stringent AEC-Q100 standards, features embedded Functional Safety (FuSa) capabilities, and has been designed to meet the requirements of ISO26262 ASIL-D – the highest level of automotive safety integrity. By constantly monitoring and adjusting the suspension system in real-time, the ASIC enhances ride quality and vehicle control, ensuring optimal performance even in demanding driving conditions.
The original design and supply contract, which started production in 2022, initially focused on one flagship vehicle model. Since then, the inclusion of EnSilica’s ASICs has expanded to other vehicle models, including a new range of electric vehicles (EVs), with production ramping up from 2025.
News of this milestone comes shortly after EnSilica was awarded an additional ASIC design and supply contract by process automation giant, Siemens.
In January 2024, EnSilica enhanced its eSi-Crypto IP library with Post Quantum Cryptography support, positioning the company near the forefront of automotive security innovation. As the automotive industry increasingly prioritizes data security, EnSilica’s advanced cryptographic solutions will ensure that its ASICs meet the most demanding security requirements, safeguarding vehicle systems against emerging cyber threats now and in the post-quantum era.
“Our new partnership with TSMC has been a key enabler in our mission to meet the demands of leading automotive manufacturers,” comments Ian Lankshear, CEO of EnSilica. “Our commitment to delivering automotive ASIC solutions with a focus on functional safety has been validated by reaching this 5-million-unit milestone. It not only demonstrates the trust our customers place in us but also highlights our capability to consistently deliver high-volume, high-quality automotive ASICs that meet the evolving needs of the industry.”
Bernard Wu, VP of the Sensing and Control Business Unit at EnSilica, added, “The five-million-unit milestone is a testament to the strength of our fully automotive qualified supply chain. Our ASICs integrate advanced functional safety features, ensuring fault detection and system integrity even under extreme conditions. By embedding multiple safety mechanisms, such as real-time diagnostic monitoring and redundancy at the chip level, we’re enabling automotive manufacturers to achieve higher levels of vehicle performance and safety, which are crucial in what is becoming an increasingly complex and competitive industry.”
