HorngCom Technology, a division of AMB Taiwan, has announced a strategic collaboration with RRP Electronics Limited, following a successful technical review of RRP’s facility in Mumbai. This marks a significant step towards expanding HorngCom’s global footprint in the OSAT (Outsourced Semiconductor Assembly and Test) sector.
HorngCom’s technical team had evaluated RRP’s Semiconductor plant at Mahape and had cleared it for assignments from HorngCom Taiwan. Level 1 of RRP Electronics’ OSAT facility will now be upscaled to include a new production line dedicated to handling additional workload, aimed at increasing efficiency and throughput.
As part of the collaboration, HorngCom will assign a range of OSAT services and IC products to be handled at the RRP Electronics facility. These include SIM cards and modules, NAND memory chips, MOSFET components, and other integrated circuit (IC) related products. This product portfolio reflects the growing demand for advanced semiconductor solutions and will be supported by the upgraded infrastructure at the Mumbai site.
This partnership is projected to generate revenues of approximately USD 12 million for the current financial year, highlighting the strong market potential and scalability of the venture.
Rajendra Chodankar, Chairman of RRP Electronics Limited said, “This collaboration reflects our capabilities and infrastructure readiness. We look forward to a long-term partnership that brings mutual growth and innovation to the semiconductor sector and quantum growths expected in the next two quarters aiming towards self-reliance, with state to flourish and Nation prosper.”
“We are excited to embark on this collaboration with RRP Electronics,” said Elmer LingHu, Chairman of HorngCom Technology. “This step is aligned with our vision of expanding high-quality semiconductor services globally. India presents an enormous growth opportunity and our synergy with RRP will help us achieve new milestones.”
Further joint initiatives and mega plans are expected to follow as both companies aim to reinforce their partnership and offer enhanced value in the semiconductor assembly and testing ecosystem.
