PICMG, a leading consortium for developing open embedded computing specifications, has announced formation of the InterEdge 1.1 Technical Working Group (TWG). Industry professionals looking to shape future technologies throughout the process industries, including refining, chemical, oil gas, pharmaceuticals, metals and mining, pulp and paper, as well as food and beverage, are encouraged to join the standardization effort by contacting info@picmg.org or visiting members of the TWG at embedded world North America, October 8-10th in Austin, TX.
InterEdge is intended for broad process industry use as an alternative to industrial PCs (IPC), programmable logic controllers (PLC), distributed control systems (DCS) and their associated I/O modules. With its modular architecture, InterEdge can consolidate the functions of all of these systems into a single platform.
InterEdge is an open electromechanical and software interface specification designed to support the interchangeability of industrial-grade compute modules, input/output (I/O) modules, and network switches for industrial automation and process control industries. Version 1.1 of the InterEdge standardization effort seeks to build on the mechanical and interface definitions completed previously by defining standard compute modules, multi-channel I/O modules, an InterEdge reference architecture, and more.
“The InterEdge 1.1 TWG is running full speed ahead bringing the benefits of interchangeability to the automation industry,” said Matthew Burns, InterEdge 1.1 Technical Working Group chair. “The collaboration and innovation of industry leaders within the InterEdge community will drive adoption in future system builds for generations to come.”
The primary work performed by the InterEdge 1.1 TWG will include completing definitions of a compute module expansion bus, multi-channel I/O, additional I/O, thermal design, anti-tamper, out-of-band management, additional diagnostics and termination assemblies.
The working group will also define an InterEdge reference architecture that connects multiple compute and I/O modules over an internal Ethernet I/O bus. In compliance with the Open Process Automation Forum’s (OPAF’s) Open Process Automation Standard (OPAS), the reference architecture will support an IEC 61499 runtime on top of a Linux OS. IEEE 802.3 and 10Base-T1S MAC/PHYs are included to support external networking over industrial Ethernet, MQTT, DDS and other protocols.
Reference compute modules are being supplied by ASRock Industrial while the PCB and connectors are being developed by Samtec. I/O module vendors are currently being identified.
“The InterEdge specification enables interoperability and interchangeability to the process automation markets, which previously required companies to choose between proprietary solutions. The work of OPAF to address the broader needs of truly rugged edge applications will allow these markets to deploy greater IoT capabilities, including preventative maintenance, greater reporting and better process efficiencies. PICMG strives to accelerate the adoption of open standards and develop specifications as a consortium or in conjunction with like organizations,” said Jessica Isquith, president, PICMG.
Members of the InterEdge 1.1 TWG will attend the Embedded World North America conference and exhibition in Austin, TX from October 8-10. Companies and organizations interested in learning more about the new PICMG specification, the OPAS standard of which it is a part, or the ways open automation technology is enabling next-generation initiatives like software-defined manufacturing (SDM) can visit the following landing pages:
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