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Next-Gen AI Silicon Design

Cadence & TSMC Partner to Speed Up Next-Gen AI Silicon Design

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Semiconductor Skilling in India

ESSCI Partners with Synopsys to Enhance Semiconductor Skilling in India

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Mitsubishi Electric chip integration

Mitsubishi Electric Joins ROHM–Toshiba Chip Integration Talks

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R&S FormFactor MeasureOne partnership

R&S joins FormFactor’s MeasureOne partner program

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GigaDevice DACH expansion

GigaDevice Expands into DACH via SEMITRON Partnership

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High-Performance Physical AI

SiMa.ai & Kaynes Semicon Partner to Boost High-Performance Physical AI Innovation

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Automotive Physical AI Development

SiMa.ai & Synopsys Partner to Boost Automotive Physical AI Development

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Tesla – Samsung Pact Sparks U.S. AI Chip Revival

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