Mitsubishi Electric Corporation has signed a memorandum of understanding (MoU) to explore a potential integration of its power device operations with the semiconductor businesses of ROHM and Toshiba Electronic Devices & Storage Corporation, a Toshiba subsidiary. The agreement also involves Japan Industrial Partners, and TBJ Holdings.
ROHM and Toshiba’s semiconductor units have been discussing a possible merger with support from Japan Industrial Partners and TBJ Holdings since March 2024. Mitsubishi Electric has now officially joined these ongoing negotiations.
The companies see the integration as a way to create a globally competitive semiconductor business, combining technological expertise and operational scale. The move aims to strengthen Japan’s semiconductor industry, support downstream sectors, and increase the overall value of the combined entity.
Mitsubishi Electric emphasized that its assessment is still preliminary and will provide updates as talks progress, including any potential impact on its fiscal 2026 financial results.
The five parties plan to continue detailed negotiations, with any final agreement subject to regulatory approvals and legal conditions.
