In a significant move to strengthen India’s semiconductor sector, the Electronics Sector Skills Council of India (ESSCI) has partnered with Synopsys International, based in Ireland. The partnership, formalized through a Memorandum of Understanding (MoU) signed at ESSCI’s New Delhi office, aims to address the country’s talent shortage in high-tech electronics and chip design.
As part of this collaboration, ESSCI and Synopsys will host specialized bootcamps, faculty development initiatives, and hackathons to bridge the gap between academic learning and industry needs. A key aspect of the MoU is the alignment of training programs with national objectives such as PMKVY, ISM2.0, C2S, and ESDM 2.0, ensuring that students across India are better prepared for the workforce. The partnership will focus on reducing the skill gap in semiconductor design and engineering by leveraging Synopsys’ advanced tools and platforms, alongside expertise from subject matter specialists. Both organizations will also work together on offering joint certifications for participants completing the programs.
Welcoming the partnership, Madhvendra Singh, CEO, ESSCI, stated: “This collaboration with Synopsys is a cornerstone in our strategy to establish India as a global hub for semiconductor talent. By integrating industry-leading tools and global expertise into our skilling framework, we are ensuring that Indian students are trained on the same platforms used by the world’s top chip designers. Our goal is to create a seamless pipeline of ‘industry-ready’ engineers who can immediately contribute to the nation’s burgeoning ESDM ecosystem.”
As India accelerates its chip-making ambitions, this partnership between ESSCI and Synopsys is expected to play a pivotal role in creating the technical backbone required for the next generation of electronic innovation.
