Infineon Technologies has been identified by Gartner as the leading contender in AI data center power semiconductors, citing its broad product portfolio, strong manufacturing capabilities, and early investments in advanced technologies. While increasing competition in silicon carbide (SiC), gallium nitride (GaN), and compute board-level solutions continues to intensify, Infineon is strengthening its position through system-level expertise and a comprehensive power portfolio. The company expects its AI-related revenue to reach €2.5 billion by fiscal 2027, driven by its extensive AI power delivery solutions.
A broad portfolio spanning the entire power delivery chain
Gartner recognizes that Infineon secures its position in the AI data center semiconductor market through a comprehensive “grid-to-core” solution across the entire power delivery architecture, which strategically addresses the unprecedented power density and the thermal bottlenecks of high-performance AI workloads. While many competitors address only isolated stages of the data center power chain, Infineon delivers optimized semiconductor solutions at every conversion stage, from solid-state transformers (SST), power supply units (PSU) and energy storage systems (ESS) to intermediate bus conversion (IBC) and processor-level power management, ensuring that efficiency, reliability and performance are maximized across the entire system.
By optimizing every link in the power delivery chain with the right semiconductor technology at each stage, Infineon enables data center operators to reduce cumulative energy losses across multiple conversion stages, a critical advantage at hyperscale and a meaningful contribution to the industry’s broader sustainability goals.
SiC and GaN: the right technology at every stage
Reinforcing Infineon’s broad portfolio is its strategic combination of semiconductor materials. Gartner notes that Infineon’s strategic and early investments in wide-bandgap (WBG) semiconductors, including SiC and GaN, give it critical advantages in offering energy-efficient power solutions, particularly for next-generation 800 VDC AI data centers. By seamlessly integrating advanced WBG materials – specifically SiC for high-efficiency, high-voltage grid-to-rack conversions and GaN for ultradense, high-frequency intermediate power stages – alongside traditional silicon (Si) at the processor level, Infineon minimizes energy loss at every single conversion step.
From powering AI data centers to physical AI
Infineon continues to expand its partnerships across the AI value chain, working closely with system integrators, data center operators and technology leaders to accelerate the development of next-generation power architectures.
Beyond the data center, Infineon’s advanced semiconductor solutions bring physical AI to life, enabling humanoid robots, collaborative machines and autonomous systems to perceive, think and act safely and securely. With expertise spanning microcontrollers, power systems, sensing, connectivity, functional safety and security, Infineon is a trusted partner across the full spectrum of physical AI platforms. With the global robotics market projected to reach up to $1.7 trillion by 2050 and 300 million humanoids operating worldwide (UBS Research, 2025), and an estimated average semiconductor bill of materials of $500 per humanoid robot, physical AI represents one of the most significant growth opportunities of the coming decades. From the utility grid to the processor core, and from the data center to the factory floor, Infineon powers the full arc of the AI era.
Gartner Report, AI Vendor Race: Infineon Is the Company to Beat in AI Data Center Power Semiconductors, By Menglin Cao, Rajeev Rajput, May 2026. Gartner is a trademark of Gartner, and/or its affiliates.
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