MacDermid Alpha Electronics Solutions is set to participate in Power Conversion and Intelligent Motion Asia Shenzhen 2026, taking place August 26–28 at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. During the event, the company will highlight solutions designed to help manufacturers achieve more consistent and dependable attachment processes as power electronics production expands across global facilities.
With the expansion of electric vehicle power modules, telecommunications infrastructure, renewable energy systems, advanced sensing, and data center power conversion, attach quality has become a critical reliability factor. Even small variations in bond line thickness, voiding, solder volume, and interface quality can increase risk in high-power systems. Tighter thermal budgets, faster switching speeds, and rising power density now make repeatability essential from qualification through high-volume production.
MacDermid Alpha Electronics Solutions will demonstrate how its latest sintering and solder attach portfolio helps manufacturers reduce process variability, improve manufacturing consistency and achieve repeatable production across multiple lines and facilities. These materials help strengthen thermal performance while delivering greater process stability as production scales.
MacDermid Alpha Electronics Solutions will highlight two technologies designed to improve attach consistency and repeatability in high-volume power electronics manufacturing. The company will spotlight ALPHA TrueHeight Solder Preforms for Power Electronics, featuring technology that provides bond line thickness control of 75 micrometers or greater for selected power module-to-heatsink assemblies, while maintaining very tight tolerances in length and width. These tolerances help deliver consistent placement and repeatable solder volume across automated lines. The Company will also showcase the new ALPHA Argomax AccuLam 8022 silver sintering film for die attach. Offered in 65 micrometer thickness for a 20-micrometer nominal bond line, the product approach helps standardize the interconnect stack and strengthen assembly consistency.
“Across the market, customers are asking for tighter bond line control, more stable high-volume processes, and assembly solutions that can meet higher thermal demands without adding unnecessary process complexity. Our portfolio expansion addresses those requirements, said Gustavo Greca, Line of Business Director for Power Electronics at MacDermid Alpha Electronics Solutions.”
During PCIM Asia Shenzhen 2026, visitors to Hall 16, Booth G15 will have the opportunity to discuss current design challenges, compare attach material options, and receive application guidance from MacDermid Alpha Electronics Solutions’ technical specialists.
