Infineon Technologies AG and Skeleton Technologies have signed a Memorandum of Understanding (MoU) to develop efficient and resilient power solutions for next-generation data centers. As AI adoption accelerates, rising electricity demand and the need for dependable digital infrastructure are reshaping data center power systems. The collaboration will focus on solid-state transformers (SSTs) and high-power sidecars, which can improve grid-to-core power conversion, energy efficiency, and overall system reliability. By advancing these technologies, the companies aim to strengthen performance and resilience across the entire data center power delivery chain.
“AI is fundamentally transforming power infrastructure requirements. The increasing power density of modern data centers calls for new approaches to energy conversion, distribution and storage,” said Andreas Weisl, Executive Vice President & Chief Sales Officer of Industrial and Infrastructure at Infineon. “By combining Infineon’s expertise in power semiconductors with Skeleton’s innovation in supercapacitor technology and power conversion systems, we are driving the development of highly efficient and resilient power architectures that meet the demands of next-generation AI workloads.”
“Power density is becoming one of the defining constraints of AI infrastructure globally,” said Taavi Madiberk, CEO at Skeleton Technologies. “AI data centers need to deliver dramatically more power to increasingly dense GPU infrastructure, without allowing the power system itself to consume more space. Infineon and Skeleton Technologies are both working at the forefront of that challenge. By combining Infineon’s precision in converting and controlling power with Skeleton’s expertise in storing and delivering very high power at speed, we can increase power density across the AI power infrastructure and enable more compute within the same physical footprint.”
Under the agreement, Infineon and Skeleton will jointly explore and develop advanced architectures for the entire AI data center power chain that delivers electricity from grid to core. This includes next-generation SSTs for medium-voltage AC to high-voltage DC conversion. The companies intend to combine Infineon’s high-efficiency high-voltage CoolSiC power semiconductors with Skeleton’s expertise in power conversion systems and supercapacitor technology. The companies are also collaborating on gallium nitride (GaN)-based peak-shaving systems that combine Skeleton’s advanced supercapacitor technology with Infineon’s CoolGaN power semiconductors. By bringing together complementary technologies and system-level know-how, the collaboration aims to deliver breakthrough improvements in energy efficiency, power density and system reliability while helping reduce the total cost of ownership for data center operators.
