JEDEC Solid State Technology Association has introduced two new guidance documents designed to strengthen how silicon carbide (SiC) power semiconductors are tested, qualified, and evaluated for long-term reliability. The documents, JEP203 and JEP204, were created by the organization’s JC-70.2 Silicon Carbide Subcommittee and are available as free downloads.
The guidelines come as SiC technology gains wider use in applications such as electric vehicles, renewable energy installations, industrial automation systems, and power distribution infrastructure. As demand for higher-efficiency power electronics grows, the need for standardized testing and reliability assessment methods has become increasingly important.
JEP203, titled Guideline for Short Circuit Evaluation in Power Conversion Transistors, focuses on evaluating the short-circuit performance of power MOSFETs. It offers recommendations for consistent testing practices, improved protection circuit development, and enhanced system reliability during fault conditions. The guidance aims to help engineers better understand how SiC devices respond to short-circuit events, a critical factor as these components enable higher power densities and faster switching capabilities.
The second document, JEP204, Catalog of Stress Procedures for Silicon Carbide Devices for Power Electronic Conversion, provides a broad collection of reliability, environmental, and ruggedness testing procedures for SiC power devices. It establishes a common reference framework that manufacturers, qualification teams, and system designers can use to evaluate device durability and long-term performance more consistently.
According to JEDEC, the publication of these documents is intended to promote greater consistency across the industry in testing and qualification approaches. By encouraging standardized evaluation methods, the organization hopes to improve confidence in SiC-based power systems and support broader adoption of next-generation power semiconductor technologies.
Both guidelines were developed within JEDEC’s JC-70 committee, which is responsible for advancing standards for wide-bandgap semiconductors. Since its launch in 2017 with 23 member companies, the committee has expanded to more than 70 participating organizations worldwide, including semiconductor suppliers, equipment manufacturers, research institutions, universities, and system developers working with SiC and gallium nitride (GaN) technologies.
JEDEC stated that the committee’s continued growth highlights the industry’s increasing focus on creating shared standards for reliability testing, electrical characterization, and qualification of wide-bandgap semiconductors. The next JC-70 committee meeting is scheduled for July 15, 2026, as work continues to advance the adoption of emerging power semiconductor technologies.
