MacDermid Alpha Electronic Solutions, a global leader in electronic assembly materials, will introduce its latest bond pad innovations at PCIM Europe 2025 in Nuremberg, Germany, from May 6 to 8. Located at Hall 7, Booth 460, MacDermid Alpha will showcase advanced bond pad metallization solutions, engineered to enhance wire bonding, and high-reliability interconnects in power electronics.
Industry Innovation in Real Time
Bond pad metallization serves as the critical interface between semiconductor dies and interconnects in power devices, automotive electronics, and advanced semiconductor packaging. As the industry moves toward higher power densities, finer pitch designs, and stricter reliability requirements, the demand for optimized bond pad materials has never been greater.
MacDermid Alpha’s latest bond pad solutions deliver superior adhesion, enhanced conductivity, and improved corrosion resistance, ensuring higher yields and long-term reliability in EV power modules, renewable energy systems, and other high-performance applications. These innovations will be featured at PCIM 2025, offering attendees a first-hand look at their capabilities.
Improved Performance and Reliability
John Hynek, Global Product Manager for Power Electronics, will present ‘Improved Reliability for Die Top Connection in Power Electronics’ at the PCIM exhibitor stage. His session will explore the latest bond pad advancements and their impact on wire bonding as well as high-reliability interconnects. Attendees will gain insights into material performance enhancements and integration strategies for next-generation power electronics.
“With the rapid evolution of EV powertrains, renewable energy systems, and next-generation semiconductor packaging, bond pad materials play a crucial role in interconnect performance and reliability,” said John Hynek. “At PCIM Europe 2025, we are excited to showcase how our advanced bond pad solutions empower manufacturers to tackle higher power densities, reduce form factors, and extend product lifecycles.”
Join Us at Booth 460
Attendees visiting MacDermid Alpha at Hall 7, Booth 460 will experience live demonstrations, technical discussions, and in-depth product showcases. By combining a commitment to innovation, reliability, and industry collaboration, MacDermid Alpha continues to shape the future of power electronics manufacturing.
Join us at PCIM to explore how our cutting-edge materials can transform your semiconductor assembly processes.
ENDS
About MacDermid Alpha Electronics Solutions:
MacDermid Alpha Electronics Solutions, a prominent business of Element Solutions Inc, holds a distinguished position as a global leader in the field of fully integrated materials, helping to deliver enhanced performance, reliability, and sustainability to electronic manufacturers worldwide.
Their expertise is segmented as follows:
- Wafer Level Solutions: Revolutionizing wafer fabrication processes for enhanced efficiency and performance.
- Semiconductor Assembly Solutions: Driving innovation in semiconductor assembly processes for unparalleled reliability.
- Circuitry Solutions: Tailored solutions to meet the dynamic demands of modern circuitry.
- Circuit Board Assembly Solutions: Elevating circuit board assembly processes for optimal performance.
- Film & Smart Surface Solutions: Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability.
With a legacy spanning over a century of innovation, MacDermid Alpha has garnered the trust of manufacturers around the globe and is actively shaping industries such as automotive, consumer electronics, mobile devices, telecom, data storage, and infrastructure. The business is uniquely positioned to deliver high-quality solutions and technical services to comprehensively cover the entire electronics supply chain.
