MacDermid Alpha Tackles Power Module Reliability at PCIM Europe 2026

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MacDermid Alpha Electronics Solutions will showcase its latest innovations at PCIM Europe 2026, taking place from June 9–11 in Nuremberg, Germany, at Booth 7-460. The company will highlight advanced die-attach materials designed to help power electronics manufacturers enhance product reliability, minimize process variability, and support efficient production scaling.

With growing demand for higher power density and faster-switching devices across automotive, industrial, and AI data center applications, manufacturers are under increasing pressure to manage heat more effectively while ensuring consistent production quality. As a result, factors such as bond line precision, void minimization, and manufacturing repeatability have become essential for achieving reliable long-term power module performance.

At PCIM Europe 2026, MacDermid Alpha will highlight its expanded ALPHA Argomax sintering portfolio and ALPHA TrueHeight solder preforms, designed to help customers improve thermal and electrical performance while supporting more stable, high-volume manufacturing. 

MacDermid Alpha will also contribute to the PCIM Europe technical program, sharing insights on electronics assembly solutions for emerging applications. On the AI stage, John Hynek, Global Product Manager, will examine how attach materials can support the uptime and reliability demands of AI and data center infrastructure. In addition, Andreas Socarras, Senior Application Engineer, will present a poster session titled “Investigation of Large Area Soldering Using High Stress Assembly and Challenging Surface Coatings” as part of the PCIM Conference. 

Power electronics manufacturers need attach solutions that can deliver tighter process control and higher reliability without adding unnecessary complexity,” said Gustavo Greca, Line of Business Director for Power Electronics at MacDermid Alpha Electronics Solutions. “At PCIM, we will show how our latest materials can help customers improve manufacturing stability and support the next generation of power module designs.” 

Visitors to Booth 7-460 can meet with MacDermid Alpha Electronics Solutions’ technical team to discuss material selection, process integration, and application support. To schedule a meeting in advance, visit the company website.

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