MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will present this week at the SMTA New Delhi Technical Event, Bangalore Chapter. Dr Ansuman Das, Senior R&D Manager at MacDermid Alpha will deliver a technical session titled “Flux–OSP Interaction and Its Effect on Solder Wetting”.
This presentation will explore the critical interaction of flux chemistries with thermally treated OSP layers, examining their ability to remove copper oxides and improve solder wetting. Das will share demonstrated findings that show how carefully selected flux ingredients enhance dissolution and optimize hole-fill performance on pre-reflowed OSP coupons.
Session Insights
“Our work provides electronics assembly professionals with practical insights into flux–OSP behavior that directly improve solderability, assembly yields, and long-term reliability,” said Dr. Ansuman Das, Senior R&D Manager at MacDermid Alpha. “By focusing on actionable guidance, we aim to help manufacturers strengthen their processes and achieve more consistent results.”
MacDermid Alpha is delighted to be taking part in this SMTA event, located at the Sheraton New Delhi, September 12. We are proud to support the electronics manufacturing community by sharing innovations that help engineers and manufacturers address today’s most pressing assembly challenges.
