Murata Manufacturing has started mass production of its LLD series, described as the world’s smallest three-terminal low-ESL multilayer ceramic capacitors (MLCCs). With a compact 0201-inch footprint measuring only 0.6 × 0.3 mm, these capacitors occupy about 64% less board space than Murata’s previous smallest 0402-inch models, which measured 1.0 × 0.5 mm. The space-saving design helps manufacturers optimize PCB layouts for increasingly compact products, including smartphones and wearable devices.
As smartphones and wearables incorporate increasingly powerful ICs, maintaining a stable power supply becomes more challenging. High-speed operation causes current demand to change rapidly, which can lead to fluctuations in the voltage supplied to the IC. Minimizing this instability is essential for reliable performance. Three-terminal capacitors with their four, shorter current paths provide lower ESL compared with conventional two-terminal parts, helping maintain a stable power supply to the IC.
At the same time, thinner and smaller electronic devices require efficient use of limited PCB space. However, miniaturizing three-terminal capacitors has been difficult because their internal and external electrode structures are more complex than those of conventional two-terminal types.
Murata overcame this challenge by optimizing the electrode design and advancing its manufacturing processes. The resulting 0201-inch products enable high-density mounting while stabilizing the power supply voltage near ICs, even at high frequencies. This gives designers greater flexibility in component placement and circuit design around ICs, supporting higher performance in space-constrained electronic devices.
Two models are available. LLD033R60G105ME01 has a capacitance of 1 µF, a rated voltage of 4 Vdc, and an operating temperature range of -55 to +85°C. LLD033D80E105ME01 has a capacitance of 1 µF, a rated voltage of 2.5 Vdc, and an operating temperature range of -55 to +105°C.
Murata will continue developing compact, high-performance MLCCs for mobile and wearable devices, contributing to further miniaturization and enhanced performance of electronic equipment.
