Fabless startup Netrasemi has unveiled its flagship AI System-on-Chip (SoC), A2000, which has successfully completed silicon bring-up and is now moving toward commercial production.
Designed for smart vision and real-time video analytics, the A2000 enables on-device AI processing for smart cameras and edge AI platforms. Built on TSMC’s advanced 12nm process node, the chip is engineered to deliver high-TOPS AI performance along with capabilities for computer vision, video streaming, secure boot, and high-speed I/O such as PCIe.
Positioned as one of India’s first AI/ML chips, the A2000 integrates Netrasemi’s in-house Neural Processing Unit (NPU), Vision Processing Unit (VPU), Image Signal Processor (ISP), crypto engines, and multiple hardware acceleration IP cores. It also incorporates the company’s patented heterogeneous graph-stream parallel processing architecture.
Netrasemi plans to share the chip design with select OEM partners for joint research and development to explore new commercial applications. Mass production is expected to begin next year at TSMC in Taiwan.
Jyothis Indirabhai, Co-founder CEO, Netrasemi, says, “Our SoCs goes beyond conventional AI/ML integration by combining proprietary hardware acceleration IPs with domain-specific optimizations tailored for high-performance, real-time edge AI. The architecture is designed specifically for compact, power- and cost-sensitive edge devices. We are currently working with several leading OEMs to facilitate early sample evaluations, co-development, and advanced R&D initiatives”
Govt of India’s (MeitY) Semiconductor Design Linked Incentives (DLI) and Design Infrastructure Support (DIS) played a key role in achieving this critical milestone. The company was one of the first 4 startups selected for 15Cr INR DLI support in 2023 by MeitY. Netrasemi has raised Rs 125 crore in total funding till date from its marquee investors including ZOHO and Unicorn India Ventures.
These highly secure and power efficient AI chips target applications like smart cameras for surveillance, Edge AI boxes and Intelligent video gateways. The chip will go to volume production in 2027 and it is expected to address challenges of global platform developers in bringing advanced AI algorithms to small edge devices.
