OMNIVISION has introduced the OG12S10, a 12MP BSI global shutter CMOS image sensor designed for factory automation and intelligent transportation applications. Its large 3.45µm pixels deliver strong light sensitivity and quantum efficiency, while its ultra-short 1µs exposure enables precise imaging of fast-moving objects.
The OG12S10 PureCelPlus-S pixel GS sensor has on-chip dual conversion gain (DCG) high dynamic range (HDR) and features a 4096 x 3072 resolution. Nyxel near-infrared (NIR) technology enables clear image capture with high pixel sensitivity and no motion artifacts. The imaging performance of the 12MP GS sensor is further enhanced by its 12-bit ADC (analog-to-digital conversion). With a maximum of 75 frames per second (fps), the sensor can easily capture fast-moving objects.
“In situations where speed, vibration and motion are constant, maintaining image clarity becomes critical. However, not all image sensors are equipped to deliver the consistency required in these conditions,” said Kelly Yan, staff marketing manager, OMNIVISION. “Global shutter sensors, like the OG12S10, address this challenge by capturing each frame with synchronized exposure, eliminating motion-related distortions.”
Key features of the OG12S10 GS sensor:
- 12MP GS sensor with 4096 x 3072 resolution
- 3.45µm BSI pixel in a 1.1-inch optical format
- 74dB dynamic range with DCG HDR
- 20Ke- (20,000 electrons) full well capacity and 2.8e- (2.8 electrons) read noise (RN) in DCG mode
- Nyxel technology and high quantum efficiency, 60% @ 850nm and 40% @ 940nm, 5x QE boost compared with existing 3.45µm product
- 1µs ultra-short exposure time
- 106dB shutter efficiency
- PureCelPlus-S die stacking technology
- Interface: 16-lane sub-LVDS to 1.1Gbps and 4-lane MIPI
The OG12S10 GS sensor comes in a ceramic land grid array (CLGA) package and will be available for sampling in November 2026; it will be in mass production in Q4 2026.
