Power Integrations has launched a new line of TOPSwitchGaN ICs, expanding flyback converter power capability up to 440 W and providing a simpler alternative to complex resonant and LLC topologies.
By integrating PowiGaN technology with the proven TOPSwitch architecture, these ICs reduce system complexity, shorten design time, and lower overall costs. In many applications, heat sinks are no longer required, while manufacturability is improved.
The devices achieve up to 92% efficiency across a wide load range (10–100%) and comply with strict energy regulations, consuming under 50 mW in standby or no-load conditions without synchronous rectification. Their built-in 800 V GaN switches feature low RDS(ON), reducing conduction losses and enabling higher power levels in flyback designs.
With switching frequencies up to 150 kHz, these ICs support smaller magnetics and more compact designs while providing sufficient standby power for housekeeping functions, improving low-power efficiency.
Two package options cater to different needs:
- eSOP-12: low-profile, supports up to 135 W without a heat sink for compact applications like home appliances.
- eSIP-7: improved thermal performance, supports higher power with simple heat sinking, ideal for power tools, e-bikes, and industrial equipment.
Additionally, the TOPSwitchGaN ICs are pin-compatible with TinySwitch-5 devices, allowing designers to scale designs from 10 W to 440 W with a consistent development approach.
To accelerate adoption, Power Integrations provides reference designs for appliances, industrial power supplies, and e-bike chargers.
