Wolfspeed, Inc. has officially launched its 200mm silicon carbide (SiC) materials for the commercial market, marking a significant step forward in accelerating the industry’s transition from traditional silicon to SiC technology.
After initially offering 200mm SiC to select customers and receiving strong positive feedback, Wolfspeed decided to proceed with a full market release.
The company is also introducing 200mm SiC epitaxy for immediate qualification. When paired with Wolfspeed’s 200mm bare wafers, this provides exceptional scalability and quality, setting the stage for the next generation of high-performance power devices.
The new 200mm SiC bare wafers, produced at a thickness of 350µm, offer improved performance specifications, while the 200mm epitaxy features industry-leading doping and thickness uniformity.
These improvements enable device manufacturers to increase MOSFET yields, speed up time-to-market, and offer more competitive products in rapidly growing sectors such as automotive, renewable energy, and industrial markets.
Additionally, the advancements made with the 200mm SiC technology will enhance Wolfspeed’s ongoing development of 150mm SiC materials, extending these performance benefits across the company’s wider product range.
