Axcelis Technologies has launched its latest innovation, the Purion Power Series+, a next-gen ion implantation platform designed to boost performance and productivity in advanced power devices, especially those using silicon carbide (SiC) and superjunction architectures.
The Purion Power Series+ represents a comprehensive extension of Axcelis’ implant product family, covering the full spectrum of ion implantation needs. The platform introduces new product line upgrades, including the Purion H200+ SiC, tailored for high current medium energy applications; the Purion M+ SiC, optimized for medium current processing; and the Purion XE+ SiC, along with the Purion EXE+ SiC, both designed for high energy applications in next-generation device manufacturing.
Axcelis will present the Purion Power Series+ at ICSCRM 2025, taking place September 14–19 in Busan, South Korea. Alongside this platform, the company will also showcase the GSD Ovation ES, both of which are built to improve performance and efficiency in power device production across single-wafer and batch environments.
Company experts will also share insights and technical presentations on cutting-edge developments in SiC device processing during the conference.
Featured sessions include:
- Path for Superjunction Industrialization by Single Step High Energy Channeling Implant — presented by Dr. Fulvio Mazzamuto, Axcelis Technologies
- Development of High Energy Channeling Implantation Process for SiC Superjunction Devices — presented by Dr. Reza Ghandi, GE Global Research
- Effect of Silicon and Oxygen Pre-Implantation on Thermal Oxidation of 4H-SiC — presented by Dr. Enrico Sangregorio, CNR IMM
