Infineon Technologies AG introduces a high-current-density quad-phase power module featuring TLVR (trans-inductor voltage regulator) technology, specifically designed for the power demands of modern AI data centers. The new TDM24745T OptiMOS module integrates four power stages, a TLVR inductor, and decoupling capacitors into a compact 9 × 10 × 5 mm³ package. With a current density exceeding 2 A/mm², it delivers industry-leading performance, providing rapid transient response and supporting the high-current core rails needed by advanced GPUs and AI processors in both lateral and vertical power delivery setups.
“As AI workloads scale at unprecedented speed, the need for highly efficient and extremely compact power delivery has never been greater,” said Athar Zaidi, Senior Vice President and General Manager Power ICs and Connectivity, at Infineon. “With the TDM24745T, we are redefining what is possible in high‑current voltage regulation. By combining industry‑leading current density with TLVR technology in an exceptionally small footprint, we enable our customers to unlock more compute performance, reduce energy consumption, and accelerate the deployment of next‑generation AI data centers.”
As the power requirements of AI data centers continue to rise, power architectures must become more compact, responsive and efficient. The TDM24745T addresses these challenges by simplifying power architecture design, enabling higher power density to free up PCB space for additional compute resources, and delivering an extremely fast transient response. The TLVR architecture can also reduce the required output capacitance by up to 50 percent, helping system designers achieve more efficient, space‑saving layouts that directly contribute to energy savings and improved TCO across AI server platforms.
As the industry’s first TLVR quad‑phase module in this compact form factor, the TDM24745T offers up to 320 A peak current capability, making it especially well-suited for next‑generation AI processors and high‑current multiprocessor platforms. Combined with Infineon’s digital multiphase controllers, the module supports flexible and scalable architectures that accelerate system deployment in fast‑evolving AI environments. Powered by OptiMOS‑6 MOSFET technology, chip‑embedded integration and proprietary magnetics, it delivers improved efficiency and thermal performance even in the densest AI server designs, contributing to the development of more energy efficient AI factories.
The TDM24745T power module integrates seamlessly into Infineon’s end‑to‑end AI server power delivery ecosystem, which spans everything from the grid interface to the core processor rails. Leveraging the combined benefits of silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) technologies, Infineon offers a comprehensive and scalable approach to achieving the highest efficiency, robustness and power density for AI‑optimized data center architectures.
