SEMI, the global industry association supporting the semiconductor and electronics design and manufacturing supply chain, has released a new research report in partnership with Global Net Corp.. The report focuses on the glass core substrate market and its evolving trends.
Titled Glass Core Substrate Market and Development Trends, the study explores the growing potential of glass core substrates as an advanced packaging technology. It highlights rising interest in this innovation, driven by increasing demand from artificial intelligence (AI) and high-performance computing (HPC) applications, which require larger and more sophisticated semiconductor packages.
“As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, Senior Director of Market Intelligence, SEMI. “Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption.”
The report highlights increasing industry activity and investment around glass core substrates as companies prepare for the next phase of advanced packaging—providing an independent view of the technology’s market potential, development status, key players, and remaining barriers to commercialization. Under the report’s market-development scenarios, initial production could begin around 2028 in selected high-performance applications, with adoption expanding over time across larger and more complex package architectures. Based on the average of its Positive, Base, and Negative scenarios, the report projects a compound annual growth rate (CAGR) of 67.2% from 2028 to 2040. It also maps an increasingly active global development ecosystem, with companies and research organizations across Asia, North America and Europe advancing glass core substrate technologies.
Key topics covered in the report include:
- Market outlook and adoption scenarios for glass core substrates
- Technology drivers and barriers to commercialization
- Expected applications in AI, HPC, advanced processors, co-packaged optics, and image sensors
- Company activities across substrates, glass materials, equipment, processing, inspection, and related supply-chain segments
- Development hubs, consortia, and supply-chain structure
- Forecast scenarios through 2040
The Glass Core Substrate Market and Development Trends report is available in English and Japanese editions through SEMI Market Intelligence.
