Empower Semiconductor has unveiled three new embedded silicon capacitors (ECAPs) designed to meet the power integrity needs of next-generation AI and high-performance computing (HPC) processors.
The expanded ECAP lineup includes:
- EC2005P – 9.34 μF in a compact 2 mm × 2 mm package
- EC2025P – 18.68 μF in a 4 mm × 2 mm package
- EC2006P – 36.8 μF in a 4 mm × 4 mm form factor
As AI processors grow more powerful, managing high current densities and fast transient loads is increasingly difficult with board-level capacitors alone. Embedding capacitors directly into the processor substrate has become essential. Empower Semiconductor’s ECAP series enables high-density integration, providing the power integrity needed for continued processor scaling.
These new devices offer ultralow equivalent series inductance (ESL) and resistance (ESR), delivering wide-bandwidth, low-impedance performance. Their compact, precise packaging ensures seamless integration into AI and HPC processors, improving overall power delivery network (PDN) performance and system power integrity (PI).
Empower Semiconductor will share additional details on PDN optimization using ECAPs and the Crescendo vertical power delivery platform at the following events.
At the Chiplet Summit, February 17–19, 2026, Empower Semiconductor will hold two presentations:
- “Vertical Power Delivery for Chiplet Integration” by Trey Roessig on February 17 from 3:50–4:10 PM in Room GAB J
- “Assuring SoC Power Integrity with Silicon Capacitors” by Mukund Krishna on February 19 at 3:00 PM in Room E-202 (Design – 5).
At DesignCon, February 24–26, 2026, also at the Santa Clara Convention Center, Luca Vassalli will present:
- “Supercharging SoC Power Integrity with Silicon Capacitors” on February 26 from 2:00–2:45 PM in Ballroom A.
The EC2005P, EC2025P, and EC2006P ECAPs are currently available in mass production.
