The demand for higher power density in increasingly compact systems is rising across applications such as electric vehicle onboard chargers and AI data center power supplies. At PCIM Europe 2026, Infineon Technologies AG is introducing EasyPACK S, a space-saving power module and packaging solution designed to address these needs.
Featuring a low profile of just 5.6 mm and a compact footprint of approximately 33 × 36 mm², EasyPACK S supports significant system size reduction while maintaining strong thermal performance and lowering electromagnetic interference. The initial modules in this package integrate Infineon’s 1200 V CoolSiC MOSFETs G2 along with IGBT4 and IGBT7 technologies.
EasyPACK S is qualified according to the latest industrial and automotive standards. Leveraging Infineon’s .XT interconnection technology, the modules offer enhanced reliability and long lifetime. An integrated direct bonded copper substrate ensures stable thermal performance and uniform temperature distribution. By using a new plastic material and silicone gel, the modules support continuous operating temperatures of up to Tvj(op) = 175°C. PressFIT pins double the current carrying capacity and simplify PCB mounting. The mechanical design enables automated production processes through defined gripping areas, alignment holes and reduced pin to pin tolerance, helping to reduce manufacturing time and cost.
Designed with future requirements in mind, EasyPACK S is suitable for next-generation SiC and GaN devices while meeting stringent lifetime and reliability targets. Its scalable platform architecture offers exceptional design flexibility across semiconductor technologies, chip configurations, topologies and power classes, enabling optimized performance and accelerating design-in.
Availability
The first EasyPACK S modules featuring CoolSiC MOSFETs G2 and IGBT4 technology will be available starting in July. The products will be demonstrated at the Infineon booth at PCIM 2026 in Nuremberg.
