Power conversion systems in automotive and industrial sectors are advancing quickly, driving higher requirements for switching performance, thermal handling, and compact system integration. To meet these needs, Infineon Technologies AG has launched the H-DPAK, a new member of its top-side cooling package lineup featuring integrated half-bridge power stages built on 750 V CoolSiC G2 technology.
The 750 V CoolSiC G2 platform delivers the robustness and reliability margin required by modern grid and energy infrastructures. The H-DPAK integrates a complete unidirectional half-bridge power stage within a single compact package. Its split lead-frame design with optimized drain pads improves heat dissipation and maintains clearance compliance, even in densely packed high-power PCB layouts. It also aligns with the industry-standard 2.3 mm height of Infineon’s existing Q-DPAK and TOLT packages, enabling straightforward board-level compatibility.
Overall, the solution offers liquid-cooling readiness, scalability, and drop-in compatibility while reducing parasitic loop inductance for cleaner high-speed switching. It also enables smaller passive components and delivers strong CoolSiC performance, including low RDS(on) × QOSS, best-in-class RDS(on) × Qfr, and high robustness under avalanche, overload, and short-circuit conditions.
The H-DPAK half-bridge is engineered as a core switching cell adaptable across a broad range of power conversion topologies. Its integrated architecture enables more compact applications where the space utilization and total cost of ownership are priority. Operating at higher switching frequencies than discrete board-level solutions, the H-DPAK delivers measurable improvements in dynamic performance, enabling more compact magnetic designs and higher overall system efficiency. Target applications span the full breadth of industrial and automotive power systems:
- Next generation HVDC AI PSU (5L ANPC)
- HVDC Battery and Capacitor Backup Unit
- Solid State Transformer
- Residential Solar and Energy storage
- Humanoid charging
- Two-stage and single-stage on-board chargers (OBCs)
- DC-DC converters
- Auxiliaries for electric vehicles (xEVs)
The 750V CoolSiC G2 delivers low Qg for reduced gate drive losses, high dv/dt capability for high-frequency operation, and wide gate-bias tolerance for greater design margin and compatibility with existing gate driver architectures, well suited for high-power industrial and automotive applications where robustness and switching efficiency are paramount.
The H-DPAK expands Infineon’s top-side cooled family, enabling native liquid cooling in today’s most demanding and rapidly evolving applications.
