Microchip Technology has launched the MCPF1525 Power Module to address the growing need for efficient, dependable, and adaptable power solutions in AI-driven data centers. This highly integrated module is designed to simplify power design, improve energy efficiency, and ensure stable operation in advanced AI systems.
The MCPF1525 combines a 16 V input buck converter that delivers up to 25 A per module, with support for paralleling multiple units to achieve up to 200 A. This scalability allows higher power delivery without increasing rack space. The module also features programmable PMBus and I²C interfaces and is optimized for next-generation PCIe switches and high-performance compute processors used in AI applications.
A key highlight is its vertical package design, which improves space efficiency by reducing board area by up to 40% compared to traditional solutions. Measuring roughly 6.8 mm × 7.65 mm × 3.82 mm, the compact form factor makes it ideal for dense, power-hungry AI servers.
For reliability, the module includes built-in protection and diagnostic functions such as over-temperature, over-current, and over-voltage monitoring, all accessible through the PMBus interface. It supports a wide operating temperature range from –40°C to +125°C and features an integrated EEPROM that enables customizable power-up settings.
The MCPF1525 also uses a specially designed integrated inductor to reduce conducted and radiated noise, enhancing signal integrity and overall system reliability in high-speed computing environments. This new offering further strengthens Microchip’s extensive lineup of DC-DC power modules, covering input voltages from 5.5 V to 70 V in compact, rugged, and thermally efficient packages built for high power density.
