MosChip Technologies, a prominent provider of silicon and product engineering solutions, has announced the successful initial silicon bring-up of a custom System-on-Chip (SoC) developed for ISRO’s SAC using a 28nm technology node. This achievement marks the completion of a full turnkey ASIC program, spanning from Netlist design all the way to packaged silicon.
After the chip’s tape-out using MosChip’s established Netlist-to-GDSII flow and methodology, the company handled the substrate design for a 10-layer FC-CBGA package, managed assembly, and tested engineering samples on automated test equipment (ATE), verifying that the chip meets all design specifications.
Space Applications Centre (SAC) is a premier research and development institution under the Indian Space Research Organization (ISRO), with multi-disciplinary expertise in satellite technology and space-borne applications. As a leading center of excellence, SAC specializes in designing and developing innovative satellite systems for earth observation, communication, navigation, and scientific research, serving both national and international stakeholders. With its world-class facilities and technological innovation, SAC continues to advance space science and applications for societal benefit.
The program exemplifies MosChip’s integrated Turnkey ASIC capability. MosChip managed every critical phase – DFT architecture; DFT implementation and verification; full-chip physical design and signoff; RDL design and routing; package design; tester board design; and post-silicon bring-up and validation – reducing interface risk between phases, compressing timelines, and ensuring cohesive execution across silicon, packaging, and test. Packaged silicon has been delivered and validated, enabling SAC to proceed to the next stage of productization.
“We are proud to have delivered this critical program. This milestone validates MosChip’s turnkey Netlist-to-Silicon capability and our commitment to single-owner accountability from design intent to validated silicon. By unifying design, implementation, packaging, and ATE validation, we help customers move from Spec/RTL to silicon with predictable schedules and first-pass silicon success,” said Srinivasa Rao Kakumanu, CEO & MD, MosChip Technologies.
