Saelig Company, has introduced custom RF Form-In-Place (FIP) gasket shielding services from EECL, expanding access to advanced EMI/RFI shielding solutions for high-frequency electronic applications.
EECL’s automated FIP gasket technology combines conductive elastomers, microwave absorbers, and environmental sealing materials to provide effective compartmentalized shielding and cavity resonance suppression on RF PCBs. These tailor-made solutions are designed for demanding aerospace and commercial electronics applications, offering low outgassing characteristics and broadband suppression across frequencies ranging from 10 MHz to 100 GHz.
The company also develops custom RF and microwave enclosures engineered to match specific circuit requirements, delivering high levels of electromagnetic isolation and optimized RF performance. EECL’s absorber technologies can achieve more than 100 dB attenuation across multiple frequency bands, including L, S, C, X, Ku, Ka, and K bands, helping enhance signal integrity and system reliability.
Meticulously machined and plated with high-loss tangent nickel, EECL enclosures provide exceptional suppression of electromagnetic interference (EMI) and resonance. These enclosures are fully customizable, with precision machining and plating processes and can be designed to enclose the customer’s PCB as part of the finished product. EECL is able to screen around connectors, on side walls and provide a complete EMC shield from the outside world. The internal surfaces are precision-roughened to optimize RF isolation by reducing internal coupling, while the external surfaces are polished smooth for a clean, professional appearance.
Enhanced with EECL’s industry-leading isolation gasket and advanced microwave absorber, each enclosure offers best-in-class, repeatable shielding effectiveness to ensure manufacturing success every time – far superior to adhesive gasket methods. EECL’s advanced microwave absorber is chemically bonded to the roughened metal surfaces, ensuring full cavity resonance suppression without the need for adhesives, which can compromise performance. Absorber depths can be controlled down to 100 microns, allowing precision application in complex-shaped cavities. It is also possible to add a thermal pad where required for easy assembly in production. Whether for high-volume production or a single prototype, EECL’s scalable solutions are crafted to meet the rigorous standards of RF-sensitive applications over the frequency range 10MHz to 100GHz. Typical customer engagement starts with a review of the PCB and EECL can either design the enclosure or provide design guidelines to achieve optimal performance. The isolation gasket is a form-in-place, silicone elastomer containing nickel and graphite particles and can be applied to walls as thin as 30mils. When precisely CNC-applied, it provides intricate, highly effective gasket sections that achieve up to 100 dB isolation and ensures reliable, repeatable results across a wide range of applications. Unlike conventional shielding, EECL gaskets enable easy assembly, reusability, and stable performance in both high- and low-volume runs.
Key Features and Capabilities
- Form-in-Place (FIP) Technology: EECL uses automated dispensing to apply conductive elastomers, which can be applied directly to complex or narrow, small-cavity designs down to an accuracy of 20 microns.
- Microwave Absorption: proprietary thin, flexible elastomer designed to attenuate broadband cavity resonances.
- Environmental Resistance: The gasket absorbers handle up to 170degC; low outgassing, ideal for space-grade applications.
- Wide Application Range: e.g. radar antenna nacelles, anechoic enclosures, antennamounts, military/aerospace hardware.
A descriptive video is here: https://www.youtube.com/watch?v=RXXdrKlgTZg
