X-FAB Silicon Foundries SE is expanding its role in wide bandgap (WBG) semiconductor manufacturing by adding dMode GaN-on-Si foundry services to its XG035 technology platform. This move strengthens its position as a pure-play foundry supporting a broad range of GaN and SiC applications, helping fabless companies accelerate innovation in high-performance power electronics.
The new capability is based at X-FAB’s 8-inch fab in Dresden, one of six global sites. This facility blends advanced GaN expertise with analog CMOS manufacturing in a stable, automotive-grade environment. It’s specially equipped to handle thicker GaN-on-Si wafers, meeting the needs of markets like automotive, industrial, renewables, medical, data centers, and more.
With deep experience in high-voltage GaN, X-FAB now offers open foundry access for dMode devices. The XG035 platform includes dMode HEMTs scalable from 100V to 650V, commonly used in power conversion. X-FAB also supports custom GaN designs, such as eMode HEMTs and Schottky Barrier Diodes, for applications in high-frequency rectification, power supplies, and solar energy—where efficiency and reliability are crucial.
This development comes as global demand rises for energy-efficient technologies. The push for electric vehicles, renewables, and AI-driven data centers is increasing the need for high-performance, power-efficient semiconductor solutions.
GaN-on-Si technology is a game-changer thanks to its ability to switch at high frequencies while maintaining very low on-state resistance (RDS(on)) in a small, efficient package. It offers a powerful combination of high-voltage capability and energy efficiency, perfectly complementing X-FAB’s wide bandgap (WBG) process lineup. This enables customers to design systems that enhance energy conversion from the power grid all the way to batteries, GPUs, and other devices.
To speed up adoption, X-FAB offers a process design kit (PDK) that simplifies the design process and helps customers get started faster. Additionally, starting in Q4 2025, X-FAB will launch a public multi-project wafer (MPW) shuttle service, allowing multiple customers to share a wafer for prototyping and small-scale production. This reduces costs and development time, making it easier for startups and smaller companies to enter the market.
With these initiatives, X-FAB is strengthening its leadership in GaN-on-Si technology while providing customers with scalable, efficient, and cost-effective solutions for the future of power electronics.
