MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will showcase its latest high-performance PCB and IC substrate solutions at the TPCA Show, Taipei, from October 21 to 24, booth #L213.
As high-performance computing (HPC) and artificial intelligence (AI) applications push the limits of speed, circuit density, and reliability, advanced interconnect solutions are now essential to address signal integrity, thermal management, and miniaturization challenges. Visitors to the booth will learn how MacDermid Alpha’s specialized primary metallization, electrolytic copper and final finish chemistries enable complex PCB designs and higher functionality, helping manufacturers meet the performance demands of next-generation electronics.
MacDermid Alpha’s experts will also present four technical papers at the IMPACT Conference and two presentations at the Tech x Total Solutions forum, highlighting breakthroughs in direct metallization, advanced IC substrate solutions, panel-level packaging, and sustainable final finishes.
Advanced Metallization for High-Density Designs
At the booth, MacDermid Alpha will feature next-generation metallization solutions engineered for superior reliability in high-layer-count boards and high-aspect-ratio through-holes. PC 610, advanced pulse plating technology, delivers exceptional throwing power, uniform copper thickness, and low variation to achieve enhanced reliability for complex, high-density designs. Also featured: Shadow Plus, our most advanced graphite-based direct metallization process. The technology combines greater functionality and design flexibility with significant sustainability advantages, including 50%* less power consumption, 75%* less water usage and a 70%* reduction in waste generation over traditional electroless copper.
Panel-Level Packaging Solutions for Advanced Architectures
With the rise of AI and HPC driving adoption of 2.5D and 3D package architectures, panel-level packaging is becoming essential to achieve higher chip processing capacity, yield, and throughput. MacDermid Alpha will preview its upcoming Panel Level Packaging Solutions, designed to address key manufacturing challenges such as warpage control and plating uniformity. Our innovative portfolio includes high-speed copper pillar plating processes, boric-acid free barrier technologies and high-speed acid copper solutions for simultaneous via fill and RDL plating, as well as mega pillar applications. These solutions deliver enhanced uniformity, coplanarity, reliability, and precision for advanced packaging.
Expert Presentations at the IMPACT Conference and Tech X Total Solutions Forum
Our technical experts will present six papers demonstrating our leadership in next-generation PCB and IC substrate technologies:
IMPACT Conference:
- Direct Metallization Technology Advancements – Carmichael Gugliotti (October 21st, 17:30-17:45)
- Enabling AI and HPC: Defect-Free, Co-Planar Copper Via Fill Plating Process for Advanced IC Substrates - Saminda Dharmarathna (October 22nd,15:30-16:00)
- Convergence – Overcoming Plating Challenges: WLP to PLP – Steven Tam (October 23rd, 10:40-11:10)
- Can ENIG / ENEPIG Processes be More Sustainable? – Frank Xu (October 23rd, 13:15-13:30)
At the Tech x Total Solutions Forum Steven Tam will present on metallization solutions for high-performance computing and AI applications on October 22 and Albert Tseng will discuss solutions for metallization challenges in advanced materials on October 23.
“AI and HPC architectures demand increased interconnect density and zero tolerance for defects,” explains Saminda Dharmarathna, Ph.D, R&D Line of Business Partner – IC substrate
at MacDermid Alpha Electronics Solutions. “Copper via fill plating processes are essential for ensuring reliable signal pathways and stable power delivery in advanced IC substrates, enabling the enhanced performance and reliability these applications require.”
Join us at Booth #L213 and hear our technical experts present at the IMPACT Conference and Tech X Total Solutions to discover how our chemistries are advancing connectivity for high density designs. To register for the TPCA Show please visit macdermidalpha.com
