TI Launches 300mm Wafer Fabrication Plant in Sherman

The semiconductor wafer fab is expected to manufacture tens of millions of electronic components each day.

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Texas Instruments has confirmed that its newest semiconductor fabrication plant in Sherman, Texas, is now officially producing chips, just three and a half years after construction began.

The milestone was marked with an opening event attended by TI leadership along with local and state officials, highlighting the launch of a cutting-edge 300-mm wafer fab that strengthens North Texas’s expanding technology and manufacturing base.

The facility, called SM1, will ramp output based on customer needs and, at peak operation, is expected to produce tens of millions of semiconductors each day. These chips will support a wide range of products, from smartphones and vehicles to medical devices, factory automation, smart home technologies, and data center systems.

As the leading U.S. manufacturer of foundational semiconductors, TI supplies analog and embedded processing solutions that power most modern electronics. As demand for electronics continues to grow, the company is building on its nearly 100-year history by expanding large-scale 300-mm wafer production.

By keeping its manufacturing plants, process technologies, and packaging operations under direct ownership, TI improves supply control, reliability, and long-term customer support, even during market fluctuations.

The Sherman campus is planned as a major manufacturing center, with capacity for up to four connected wafer fabs that will come online as demand increases. When fully built out, the site could support up to 3,000 direct jobs, in addition to thousands more across related industries and the regional supply chain.

This project is part of TI’s wider plan to invest over $60 billion in semiconductor manufacturing across seven facilities in Texas and Utah, marking the largest commitment to foundational chip production in U.S. history.