Texas Instruments (TI) has introduced new isolated power modules designed to boost power density, efficiency, and safety across applications from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 modules utilize TI’s proprietary IsoShield technology, a multichip packaging approach that delivers up to three times the power density of traditional discrete solutions for isolated power designs. TI is presenting these innovations at the 2026 Applied Power Electronics Conference (APEC), held March 23–26 in San Antonio, Texas.
“Advances in packaging are transforming the power industry, and power modules are leading the way,” said Kannan Soundarapandian, vice president and general manager of High Voltage Products at TI. “Our IsoShield technology gives power engineers exactly what they need: more compact solutions with higher efficiency and reliability, and faster time to market. This demonstrates TI’s ongoing commitment to pushing the limits of power semiconductor technology to tackle today’s engineering challenges.”
Redefining power density with TI’s packaging technology
Historically, power designers have turned to power modules to conserve valuable board space and simplify the design process.[SL1] As chip sizes reach their physical limits and miniaturization increases in importance, advancements in packaging technology are enabling further performance and efficiency gains.
TI’s new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation.
Advancing data center and EV performance through power innovations
Power density innovations are nowhere more critical than in today’s evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI’s IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world’s digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance.
For more information about TI’s proprietary IsoShield technology, see the technical article, “Isolated power modules with IsoShield technology cut solution size by as much as 70%.”
Building on our power module innovation
For decades[SL2] , TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages[SL3] , TI’s semiconductors empower engineers to maximize performance in any power design or application.
For more information on TI’s power module portfolio, see ti.com/powermodules.
Innovating what’s next in power at APEC 2026
In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI’s portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors.
Pradeep Shenoy, TI computing power technologist, will also present “Reimagining Data Center Power Architecture” from 1:30 p.m. to 2 p.m. Tuesday, March 24, in Expo Theater 1.
For more information about TI at APEC, see ti.com/APEC.
Availability
Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available.
| Part number | Package size | Voltage |
| UCC34141-Q1 | 5.85mm ´ 7.5mm ´ 2.6mm | Mid voltage (6V-20V) |
| UCC33420 | 4mm ´ 5mm ´ 1mm | Low voltage (5V) |
